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title: "OreSat C3 Card"
subtitle: |
Fabrication and Assembly Information
For build TIME-STAMP
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geometry:
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The C3 ("Command, Control, and Communications") card is the main on-board computer (OBC) / housekeeping unit (HKU) / Command and Data Handling (CDH) subsystem for the open source OreSat CubeSat system. The C3 card:
| Filename | Notes |
|---|---|
| README.pdf | This README file |
| PROJECT-NAME-outline.dxf | Board outline (with holes) in DXF format |
| PROJECT-NAME-pcba.step | 3D model of PCBA (with components) |
| PROJECT-NAME-render-bot.jpg | Render of the top of the 3D model |
| PROJECT-NAME-render-bot.jpg | Render of the bottom of the 3D model |
| PROJECT-NAME-schematic.pdf | PDF of board schematics |
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| Layer | Thickness | Notes |
|---|---|---|
| Top Copper | 0.043 mm / 1.7 mil | Layer 1 foil, 1 oz Cu after plating |
| prepreg | 0.200 mm / 7.9 mil | Prepreg - Isola FR408HR 2113 |
| Layer 2 | 0.018 mm / 0.7 mil | Layer 2 foil, 0.5 oz Cu |
| Core | 0.991 mm / 39 mil | Core Isola FR408HR |
| Layer 3 | 0.018 mm / 0.7 mil | Layer 3 foil, 0.5 oz Cu |
| prepreg | 0.200 mm / 7.9 mil | Prepreg - Isola FR408HR 2113 |
| Bottom Copper | 0.043 mm / 1.7 mil | Layer 4 foil, 1 oz copper after plating |
| Total Stackup | 1.588 mm / 62.5 mil |
| Filename | Notes |
|---|---|
| PROJECT-NAME-ipc2581.xml | IPC-2581 board information file |
| Filename | Notes |
|---|---|
| PROJECT-NAME-Edge_Cuts.gbr | RS274X file for the dimension (outline) layer |
| PROJECT-NAME-F_Silkscreen.gbr | RS274X file for the top silkscreen |
| PROJECT-NAME-F_Mask.gbr | RS274X file for the top soldermask |
| PROJECT-NAME-F_Cu.gbr | RS274X file for the top copper layer |
| PROJECT-NAME-In1_Cu.gbr | RS274X file for the layer 2 copper |
| PROJECT-NAME-In2_Cu.gbr | RS274X file for the layer 3 copper |
| PROJECT-NAME-B_Cu.gbr | RS274X file for the bottom copper layer |
| PROJECT-NAME-B_Mask.gbr | RS274X file for the bottom soldermask |
| PROJECT-NAME-B_Silkscreen.gbr | RS274X file for the bottom silkscreen |
| PROJECT-NAME-NPTH.drl | Excellon file for non-plated through holes |
| PROJECT-NAME-PTH.drl | Excellon file for plated through holes |
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| Filename | Notes |
|---|---|
| PROJECT-NAME-ipc2581.xml | IPC-2581 board information file |
| Filename | Description |
|---|---|
| PROJECT-NAME-bom.csv | BOM in Comma Separated Variable format |
| Filename | Notes |
|---|---|
| PROJECT-NAME-B_Paste.gbr | RS274X file for top/front solder paste stencil |
| PROJECT-NAME-F_Paste.gbr | RS274X file for bottom/back solder paste stencil |
| Filename | Description |
|---|---|
| PROJECT-NAME-3u.pos | Pick and place locations for components |
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