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A production-grade, 4-layer PCB development board built around the ESP32-S3-WROOM-1 module.
Designed for signal integrity, RF performance, and professional-grade hardware standards.
This project is an advanced, production-ready development board based on the ESP32-S3-WROOM-1 module. It was designed with a focus on:
This board is suitable for makers, engineers, and students who want a reliable ESP32-S3 platform for IoT, wireless communication, sensor integration, or embedded systems development.
| Feature | Detail |
|---|---|
| 🧠 MCU | ESP32-S3-WROOM-1 — Dual-core Xtensa LX7, Wi-Fi 4 & BLE 5.0 |
| ⚡ USB | Native USB-C for programming and power |
| 🔋 Power | 5V input → 3.3V via AMS1117-3.3 LDO |
| 📡 RF | Keep-out zone for optimized antenna performance |
| 📐 PCB | 4-layer stackup for reduced EMI |
| 🔌 Headers | UART, I2C, SPI — fully broken out |
| 📊 ADC | 2× dedicated analog input channels |
| 🔴 LEDs | Power LED (D1) + User-programmable LED (D2) |
| 🔘 Buttons | RESET (EN) + BOOT (GPIO0) |
| 🧪 Test Points | 5V, 3.3V, GND, TX, RX (TP1–TP5) |
| Parameter | Value |
|---|---|
| Microcontroller | ESP32-S3-WROOM-1 |
| CPU | Dual-core Xtensa LX7 @ up to 240 MHz |
| Wireless | Wi-Fi 802.11 b/g/n (2.4 GHz) + BLE 5.0 |
| Flash | Built-in (varies by module variant) |
| Input Voltage | 5V DC via USB-C |
| Operating Voltage | 3.3V (regulated via AMS1117-3.3) |
| PCB Layers | 4 (Signal / GND / Power / Signal) |
| PCB Tool | KiCad 9.0 |
| USB Interface | Native USB (D+/D- differential pair) |
| Programming | USB-C (native), UART via test points |
The board uses a 4-layer stackup to deliver superior electrical performance.
By using dedicated internal planes for GND and 3.3V, electromagnetic interference (EMI) is significantly reduced, and power distribution is stabilized across the entire board.
The USB-C data lines are routed as 90-ohm controlled impedance differential pairs:
A dedicated RF Keep-Out Zone is defined beneath the ESP32-S3-WROOM-1 antenna region:
The AMS1117-3.3 was chosen for its:
⚠️ Note: For battery-powered or low-power designs, consider a more efficient LDO (e.g., MIC5219 or TPS7A20).
| Layer | Type | Description |
|---|---|---|
| Layer 1 (Top) | Signal | Components, USB, buttons, LEDs |
| Layer 2 | GND Plane | Solid ground pour — EMI shield & return path |
| Layer 3 | Power Plane | Solid 3.3V pour — stable power delivery |
| Layer 4 (Bottom) | Signal | Additional routing |
| Header | Signals |
|---|---|
| UART | TX, RX, GND, 3.3V |
| I2C | SDA, SCL, GND, 3.3V |
| SPI | MOSI, MISO, SCK, CS, GND, 3.3V |
| ADC | ADC_CH1, ADC_CH2, GND |
| GPIO | Spare GPIO pins for custom expansion |
| Test Points | TP1 = 5V · TP2 = 3.3V · TP3 = GND · TP4 = TX · TP5 = RX |
| Folder / File | Description |
|---|---|
Hardware/ | KiCad 9.0 project files (.kicad_pcb, .kicad_sch, .kicad_pro) |
Manufacturing/ | Production-ready Gerber, Drill, and POS files |
Images/ | High-quality 3D renders |
.gitignore | Git ignore rules |
LICENSE | MIT License |
README.md | This file |
The /Manufacturing folder contains all files needed for PCB fabrication, compatible with major manufacturers:
| Service | Notes |
|---|---|
| JLCPCB | Recommended — affordable 4-layer PCBs |
| PCBWay | Good quality, various finish options |
| OSH Park | US-based, ENIG finish standard |
Recommended fab settings:
| Parameter | Value |
|---|---|
| Layers | 4 |
| PCB Color | Black (recommended) |
| Surface Finish | HASL or ENIG |
| Board Thickness | 1.6mm |
| Copper Weight | 1oz outer / 0.5oz inner |
| Min Trace/Space | 0.15mm |
| Min Hole Size | 0.3mm |
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