Loading files…
A compact (21 × 16 mm) 2-layer breakout board for the Bosch BME280 temperature / humidity / pressure sensor, designed from schematic to manufacturable layout in KiCad. The repository contains the full design source, bill of materials and fabrication instructions, plus a write-up of every design decision for reproducibility.
┌───────────────────────────┐
│ 3V3 ○ │
│ GND ○ [R][R][R] [C][C] │ 21 x 16 mm, 2 layers
│ SDA ○ ┌────┐ │ BME280 in LGA-8
│ SCL ○ │BME │ │ I2C @ address 0x76
│ SDO ○ └────┘ │
└───────────────────────────┘
0x76). SDO is broken out on the header so the address
can be changed to 0x77 externally.3V3 · GND · SDA · SCL · SDO (2.54 mm, breadboard-friendly).├── hardware/
│ ├── sensor-breakout.kicad_pro KiCad project
│ ├── sensor-breakout.kicad_sch schematic
│ └── sensor-breakout.kicad_pcb 2-layer PCB layout
├── fabrication/
│ ├── BOM.csv bill of materials with MPNs
│ └── README.md Gerber/drill generation (kicad-cli)
├── docs/DESIGN.md full design write-up (DFM, decisions)
└── LICENSE
hardware/sensor-breakout.kicad_pro.B to refill the copper zones, then run DRC.See fabrication/README.md — one kicad-cli
command produces a Gerber ZIP accepted by JLCPCB, PCBWay or OSH Park.
All parts are basic/extended parts at JLCPCB; the board can also be
hand-assembled with a hot plate or hot-air station (the LGA-8 is the
only tricky part — see the soldering notes in the design write-up).
MIT — see LICENSE.
No comments yet. Be the first to ask about this board.