📡 ESP32 IoT Node - 4-Layer PCB Design

This project is a compact IoT node built around the ESP32-WROOM module, designed using KiCad. The main focus here was on creating a clean, reliable PCB layout that handles power and RF performance properly, especially in a small form factor.

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🚀 What this design focuses on

The board uses a 4-layer stackup to keep things stable and reduce noise. With dedicated ground and power planes, it’s easier to manage EMI and ensure the ESP32 and its peripherals get consistent power.

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🛠️ Technical Details

• EDA Tool: KiCad (tested on newer versions)

• Layer Stack: 4 layers (Signal – GND – VCC – Signal)

• Connectivity:

  • WiFi (2.4 GHz)
  • Bluetooth Low Energy
  • UART, I2C, SPI breakouts

• Power Design:

  • Onboard 3.3V LDO
  • Decoupling placed close to the ESP32 module

• Extras:

  • Optional footprint for I2C-based security/authentication chips

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🧩 Features

• Power Integrity
  Uses solid ground and power planes along with stitching vias to reduce noise and voltage drops.

• RF Layout Considerations
  Proper antenna keep-out area and spacing to help maintain good wireless performance.

• Compact Design
  Kept small enough to fit into typical IoT enclosures.

• Manufacturing Ready
  Includes footprints and files suitable for fabrication and assembly (BOM, CPL, etc.).

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🖼️ Gallery

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Notes

This project is mainly focused on PCB design practices for IoT hardware. It’s a good reference for working with multi-layer boards, handling RF modules, and keeping power delivery clean.