Thin-Pod-rev0.1
PublicLoading…
Thin-Pod rev 0.1
OSHWA Certified Open Source Hardware · UK000091
Certified 28 May 2026 · View certification record
Overview
Thin-Pod rev 0.1 is a compact analogue vibration-sensing carrier board intended for experimental condition-monitoring work on motors, pumps, fans, gearboxes and similar rotating machinery. The board supports an ADXL1005-based analogue accelerometer signal path and provides protected power entry, a regulated and switched sensor supply, signal conditioning, accessible test points and a mating interface for a commercially supplied Qorvo DWM3001-CDK development board.
The design is published as an open-hardware PCB release: editable KiCad source files, project-local library files, fabrication outputs, bill of materials and verification documentation are provided in this repository.
The release is intentionally bounded: its value lies in producing a reproducible, inspectable measurement endpoint whose power path, signal path, interface assumptions and validation evidence can support later Gateway-side analysis, reporting and evaluation work within a clearly defined certified hardware boundary.
Certification scope
The OSHWA certification for Thin-Pod rev 0.1 covers the creator-designed sensor-node carrier PCB and its release documentation.
Included in scope
- Two-layer Thin-Pod carrier PCB design.
- Protected power-entry path, fuse provision and reverse-polarity protection.
- Regulated 3.3 V power path and PFET-switched accelerometer supply.
- ADXL1005 analogue sensor interface and conditioned signal path.
- Electrical test points for bring-up and measurement.
- Thin-Pod-authored mating interface for a Qorvo DWM3001-CDK.
- Documented DWM3001-CDK ground-return limitation identified during prototype bring-up.
- Editable KiCad source files, fabrication outputs, BOM and documentation.
Outside scope
- The Qorvo DWM3001-CDK itself as open hardware.
- The Analog Devices ADXL1005 device or any vendor evaluation board as open hardware.
- The Pololu S7V8F3 regulator module as open hardware.
- The separately developed Thin-Pod Gateway.
- STM32 NUCLEO-N657X0-Q, ESP32-C6 or Gateway-side hardware.
- Implemented UWB communication, radio firmware or networking.
- Gateway-side DSP, TinyML inference, anomaly detection or predictive-maintenance classification.
- AI-assisted maintenance reporting, structured evidence-bound reports or autonomous maintenance decisions.
The commercial devices used by the board are identified as third-party components. Their original ownership and licensing remain separate from the creator-designed open hardware.
System role and infrastructure context
Thin-Pod rev 0.1 is the sensing-node hardware layer within a broader experimental condition-monitoring architecture. Its immediate role is to provide a reproducible, inspectable and electrically verified vibration-measurement endpoint for motors, pumps, fans, gearboxes and similar rotating machinery.
Machine / motor / pump
↓
Thin-Pod rev 0.1 sensing node
↓
ADC / UWB-capable commercial module interface
↓
Gateway transport and analysis layer
↓
Maintenance telemetry / diagnostic workflow
The infrastructure concerns addressed by this release are measurement integrity, power-path robustness, interface definition, third-party component boundaries, traceable validation evidence and manufacturable open-hardware documentation.
The certified open-hardware scope includes the Thin-Pod rev 0.1 sensing-node carrier PCB and its release documentation. The ADC-capable commercial module interface is documented as part of the board design, while the commercial module remains a commercial third-party product outside the open-hardware claim.
Gateway transport, UWB communications, networking, DSP, TinyML, anomaly detection and maintenance-diagnostic workflows are shown here to clarify the intended system context. Their implementation and evaluation belong to later Thin-Pod system work outside the certified rev 0.1 hardware release.
This boundary is deliberate. Thin-Pod rev 0.1 is designed to make the physical measurement layer explicit before higher-level interpretation is attempted. Later Gateway or software layers can consume the resulting signal path. DSP, anomaly detection, AI-assisted reporting and maintenance recommendations require separate implementation, evaluation and documentation.
Functional architecture
Mechanical vibration
↓
ADXL1005 analogue accelerometer interface
↓
Analogue conditioning / filtered signal node
↓
Accessible test point and CDK ADC interface
↓
Commercial Qorvo DWM3001-CDK connection
Power is arranged as:
RAW_IN → fuse provision → 1N5817 reverse-polarity protection
→ Pololu S7V8F3 regulated 3.3 V rail
→ PFET-switched accelerometer supply
Evidence-chain design intent
Thin-Pod rev 0.1 is intended to support an evidence-chain approach to experimental condition monitoring. The carrier board provides the physical sensing and interface layer; later Gateway-side work may attach acquisition metadata, operating-context records, DSP feature outputs, baseline comparisons and report provenance.
In that wider architecture, the hardware layer should remain distinct from any interpretive software layer. The board records or exposes a vibration signal; fault diagnosis belongs to later software, validation and reporting layers. This separation is important for reproducibility, safety, evaluation and possible future AI-assisted reporting workflows.
DWM3001-CDK ground-return limitation
During bring-up of an earlier pre-release manufactured prototype, the original power-entry arrangement failed to provide the assumed functional CDK ground return by itself. A temporary ground jumper allowed successful electrical bring-up and measurement of the sensor path.
This result remains part of the prototype history and defines a known rev 0.1 evidence boundary. The released rev 0.1 documentation treats the jumper as a prototype bring-up workaround. Any copper-level correction to the CDK ground-return arrangement belongs to a future design update if the board is revised, regenerated and manufactured.
The following CDK ground points were identified as the relevant grounding points for any future corrected implementation:
J1_2 GND ─┐
J10_6 GND_1 ─┤
J10_9 GND_2 ─┤
J10_14 GND_3 ─┼── GND
J10_20 GND_4 ─┤
J10_25 GND_5 ─┘
The temporary jumper is evidence from prototype bring-up rather than an assembly requirement for a verified corrected rev 0.1 board. A future revision may incorporate the ground-return correction in copper, subject to updated source files, regenerated fabrication outputs and physical verification if that work is funded and pursued.
Validation status
The first manufactured pre-release prototype established that the core sensor-node approach is electrically viable. Measurements made during prototype bring-up included:
| Validation item | Result | Evidence status |
|---|---|---|
| Manufactured PCB inspection and initial assembly | Completed | Documented in bring-up record and images |
| Power-up after temporary CDK ground-return correction | Successful | Documented prototype result |
| Switched accelerometer supply rail | Approximately 3.35 V measured | Documented prototype result |
| Filtered analogue sensor output | Approximately 1.76 V measured at rest | Documented prototype result |
| Mechanical excitation / tap response | Visible on oscilloscope | Documented prototype result |
| CDK ground-return limitation identified | Completed | Documented prototype result |
| Copper-level ground-return correction | Deferred | Future revision only if implemented, regenerated and released |
| Physical test of a future corrected board without jumper | Deferred | Future evidence only if a corrected board is manufactured and measured |
The prototype measurement evidence supports the power and analogue signal-chain design. The ground-return limitation remains visible in the rev 0.1 evidence boundary; any future copper-level correction belongs to a later design update if the board is revised and fabricated.
Repository contents
Thin-Pod-rev0.1/
├── CHANGELOG.md
├── LICENCE-DOCUMENTATION.md
├── LICENCE-HARDWARE.md
├── README.md
│
├── docs/
│ ├── README.md
│ ├── certification-scope.md
│ ├── design-verification.md
│ ├── footprint-provenance.md
│ ├── future-revisions.md
│ ├── prototype-bring-up-and-release-correction.md
│ ├── third-party-components.md
│ └── versioning-policy.md
│
├── hardware/
│ ├── bom/
│ │ ├── Thin-Pod_rev0.1_BOM.csv
│ │ └── Thin-Pod_rev0.1_BOM.md
│ │
│ ├── fabrication/
│ │ ├── RELEASE-MANIFEST.md
│ │ ├── drills/
│ │ ├── gerbers/
│ │ └── Thin-Pod/
│ │ └── rev0.1/
│ │ └── fabrication/
│ │ └── Thin-Pod_rev0.1_OSHWA_source_and_fabrication_outputs.zip
│ │
│ └── source/
│ ├── Thin-Pod.kicad_pcb
│ ├── Thin-Pod.kicad_pro
│ ├── Thin-Pod.kicad_sch
│ ├── footprints/
│ │ └── Thin-pod.pretty/
│ │ └── ThinPod_DWM3001CDK_Mating_Interface_revA_KiCad10.kicad_mod
│ ├── fp-lib-table
│ └── sym-lib-table
│
├── images/
│ ├── README.md
│ ├── certification/
│ │ └── oshwa-uk000091.png
│ ├── thin-pod rev 0.1.jpeg
│ └── thin-pod working prototype-power supply not in scope.png
│
└── oshwa/
├── README.md
└── application-record.md
Design and fabrication files
| Resource | Location | Purpose |
|---|---|---|
| Editable KiCad project, schematic and PCB | hardware/source/ | Preferred source for modification |
| Project-local footprint and KiCad library tables | hardware/source/ | Project-local footprint source and KiCad library resolution files |
| Gerber and drill files | hardware/fabrication/ | PCB fabrication outputs |
| Bill of materials | hardware/bom/ | Assembly and sourcing record |
| Certification, design and release-governance documentation | docs/ | Scope, provenance, validation and versioning records |
| OSHWA application and certification record | oshwa/application-record.md | Public submission details and certification UID |
The editable KiCad source files are the normative design source. Gerbers and drill files are derived fabrication outputs supplied for convenience and reproducibility.
Bill of materials
The release BOM covers the Thin-Pod rev 0.1 sensor-node carrier board only. It identifies the fitted PCB components, commercial subassemblies, component values, footprints and sourcing information required to reproduce this release.
The Gateway, Gateway-side radio components, ESP32 networking hardware and analytic processing hardware sit outside this BOM and outside the rev 0.1 certification scope.
See:
Third-party components
Thin-Pod rev 0.1 is an open carrier-board design built around commercially available components. The following items are used or interfaced by the design and remain commercial third-party products outside the open-hardware contribution of this project:
| Component | Function in Thin-Pod rev 0.1 | Treatment in this release |
|---|---|---|
| Analog Devices ADXL1005-based accelerometer implementation | Analogue vibration sensing | Commercial third-party component; interface documented |
| Qorvo DWM3001-CDK | Commercial module connected through the pod-side mating interface | Commercial third-party development board; original licensing retained |
| Pololu S7V8F3 | Regulated 3.3 V supply module | Commercial third-party module |
| ZVP2106A and standard passive/protection components | Power switching and analogue support circuitry | Commercial bought-in components identified in BOM |
Vendor documentation is referenced for sourcing and interface understanding; vendor CAD files, proprietary board layouts and vendor 3D models remain outside the Thin-Pod hardware licence distribution.
CDK mating-interface footprint provenance
The published footprint:
hardware/source/footprints/Thin-pod.pretty/
└── ThinPod_DWM3001CDK_Mating_Interface_revA_KiCad10.kicad_mod
is a Thin-Pod project-local mating-interface footprint for the commercially supplied DWM3001-CDK. It is intended to describe only the mechanical and electrical connection required by the Thin-Pod carrier PCB.
The release footprint was independently constructed in KiCad using standard connector geometry, publicly available interface information and mechanical verification against a purchased CDK unit. The released source distributes the Thin-Pod mating-interface footprint, with Qorvo-supplied CAD footprints, CDK PCB design files and vendor 3D models kept outside the release package.
Opening and modifying the design
The source design is maintained in KiCad 10.0.1. The project is intended to be portable through project-local symbol and footprint tables.
A reproducible modification workflow is:
- Open
hardware/source/Thin-Pod.kicad_proin KiCad 10.0.1 or a compatible later version. - Confirm that project-local symbol and footprint libraries resolve through
sym-lib-tableandfp-lib-table. - Run schematic ERC and PCB DRC before fabrication.
- Regenerate Gerber and drill outputs after any accepted design change.
- Inspect copper, solder mask, silkscreen, board outline and drill alignment in KiCad Gerber Viewer before ordering.
Documentation and verification record
| Document | Content |
|---|---|
docs/certification-scope.md | Formal inclusion and exclusion boundary for certification |
docs/third-party-components.md | Commercial component and vendor-material notice |
docs/footprint-provenance.md | Origin and verification of the CDK mating-interface footprint |
docs/prototype-bring-up-and-release-correction.md | Prototype test result and ground-return limitation record |
docs/design-verification.md | Electrical and fabrication verification record |
docs/future-revisions.md | Items explicitly outside this release |
docs/versioning-policy.md | Meaning of v0.1, v0.1.x, v0.2 and later tags |
CHANGELOG.md | Release-boundary and documentation-correction sequence |
Licensing
| Material | Licence | File |
|---|---|---|
| Creator-designed hardware source, including schematics, PCB layout and Thin-Pod-authored footprint files | CERN Open Hardware Licence Version 2 — Weakly Reciprocal (CERN-OHL-W-2.0) | LICENCE-HARDWARE.md |
| Creator-authored documentation, diagrams and photographs | Creative Commons Attribution 4.0 International (CC-BY-4.0) | LICENCE-DOCUMENTATION.md |
| Software / firmware | None required or supplied for the certified rev 0.1 hardware scope | Not applicable |
Commercial components, vendor documentation and any third-party intellectual property remain subject to their respective owners' terms. The Thin-Pod licences cover the creator-authored release material, while the OSHWA certification mark is used only to identify this certified release.
OSHWA certification record
Thin-Pod rev 0.1 is certified open source hardware under OSHWA UID UK000091. The certification mark displayed near the top of this README identifies this specific certified release and links to the public OSHWA record.
| Field | Value |
|---|---|
| Project name | Thin-Pod |
| Project version | 0.1 |
| Primary project type | Electronics |
| Certification scope | Vibration-sensor node carrier PCB |
| Certification date | 28 May 2026 |
| Hardware licence | CERN-OHL-W-2.0 |
| Documentation licence | CC-BY-4.0 |
| Software licence | No software required or supplied for the certified hardware scope |
| OSHWA UID | UK000091 |
| Official record | certification.oshwa.org/uk000091 |
The certification UID and matching mark are retained in this README and in oshwa/application-record.md, keeping the boundary of the certified rev 0.1 release explicit.
Safety and regulatory note
Thin-Pod rev 0.1 is experimental sensing hardware for controlled evaluation. Safety-critical machinery, hazardous environments and regulated industrial monitoring applications require separate certification, installation assessment and safety controls. Appropriate isolation, current-limited bench testing, secure mechanical mounting and safe working practices are required during evaluation.
This open-hardware release provides OSHWA certification of the open-hardware documentation and source boundary. EMC, radio, electrical-safety and product-regulatory approvals require separate assessment. Any commercially supplied radio or development module remains subject to its own vendor documentation and applicable regulatory conditions.
References
- Thin-Pod OSHWA Certification Record — UK000091
- OSHWA Certification Mark Usage Guide
- OSHWA Certification Requirements
- OSHWA Certification Documentation Process
- OSHWA Certification Application
- Qorvo DWM3001-CDK product page
- Analog Devices ADXL1005 product page
Thin-Pod rev 0.1 is a deliberately bounded first open-hardware release: a documented vibration-sensor node PCB with a clear commercial-module boundary, an independently authored interface footprint, traceable prototype-validation evidence and an explicit record of the ground-return limitation discovered during bring-up.
No comments yet. Be the first to ask about this board.