Tbogg-Sensor-Package-PCB

Public

Loading…

README

The sensor package (strain, temperature, vibration) for the 2024 UofC GNCTR tbogg. Designed as an R&D intrastructure monitoring solution.

2x Strain Gauge Blocks
- Ulimately reads one of these two strain gauges:
  1. 100x BF350-3AA
  2. 10x BX120-2AA
- Based on this schematic
- Sensing via HX711 chip
1x On-PCB Temperature Sensor (STDS75DS2F)
- I2C
2x In-Concrete Temperature Sensors
- Thermistor-based
1x Vibration Sensor
- Model: MPU-6050 Breakout
- I2C Comms
I2C Optical Flow Sensor
Battery: 4x 18650
- TODO: choose quantity, model, holder, and connection
- In series
Battery Management System: probably the 3V3 buck-boost from the balloon project
- TODO: more info
Wireless Comms: LoRa Wio E5
- TODO: pull from balloon project
- TODO: confirm that this model is good
Microcontroller Unit (MCU)
- ESP32 Breakout

PCB orders will each recieve a new revision number.
- PCB orders will be in the format of "Rev1", "Rev2", etc.
- GitHub Releases (and Tags) will be tagged in the format of rev1, rev2, etc.
BOM changes on PCB orders should be documented as minor revisions.
- Example: rev1.1, rev1.2, etc.

Comments

No comments yet. Be the first to ask about this board.

Share Tbogg-Sensor-Package-PCB